At present, nearly 90% of domestic polysilicon enterprises have stopped production, while the continued production of Asian silicon industry and Jiangsu Zhongneng's capacity utilization rate is only about 50%. It is expected that most of the polysilicon companies that have ceased production in 2013 will be eliminated, and the industry recovery is estimated to be in 2014.
In the case of overcapacity, the demand for polysilicon is instead due to the anti-dumping of the photovoltaic industry entering a severe cold, and this phenomenon is difficult to change in a short period of time. As the price continues to fall, the leading enterprises of polysilicon have been unable to support it, and they have stopped production. Although each manufacturer has a quotation, there is basically no sales.
Silicon wafer back Grinding Wheels are mainly used for the thinning and fine grinding of the silicon wafer.The workpiece processed: silicon wafer of discrete devices, integrated chips (IC) and virgin, etc. Material of workpiece: monocrystalline silicon and some other Semiconductor Materials .
Application: back thinning, grinding and fine grinding.
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